検索結果156件中 1-20 を表示

  • Ishizuka Masaru ID: 9000003681643

    Department of Mechanical systems Engineering, Toyama Prefectural University (2003年 CiNii収録論文より)

    CiNii収録論文: 1件

    • B15-012 APPLICATION OF THERMAL FLOW SIMULATION TO SWITCH MODE POWER SUPPLY DESIGN : (2003)
  • ISHIZUKA Masaru ID: 9000003683664

    Toshiba Corporation (1987年 CiNii収録論文より)

    CiNii収録論文: 1件

    • Flow Resistance for Wire Nettings in Low Reynolds Number Flows : Series B : Fluids Engineering, Heat Transfer, Combustion, Power, Thermophysical Properties (1987)
  • ISHIZUKA Masaru ID: 9000003810236

    Department of Mechanical System Engineering Toyama Prefectural University (2003年 CiNii収録論文より)

    CiNii収録論文: 2件

    • TED-AJ03-106 HIGH HEAT FLUX COOLING FOR ELECTRONIC DEVICES BY SUBCOOLED FLOW BOILING WITH MICROBUBBLE EMISSION : (2003)
    • Development of Micro Channel Heat Exchanging (2001)
  • Ishizuka Masaru ID: 9000003810257

    Toyama Prefectural University (2003年 CiNii収録論文より)

    CiNii収録論文: 1件

    • TED-AJ03-102 STUDY ON THE NATURAL AIR COOLING OF ELECTRONIC EQUIPMENT CASINGS : EFFECTS OF THE OUTLET VENT AND THE POWER HEATER LOCATIONS ON THE COOLING CAPABOLITY : (2003)
  • ISHIZUKA Masaru ID: 9000003813680

    Dept. of Mechanical Systems Engineering Toyama Prefectural University (2000年 CiNii収録論文より)

    CiNii収録論文: 1件

    • H210 Forced Convection Air Cooling Characteristics of Compact Plate Fins(Electronics cooling-3) : (2000)
  • ISHIZUKA Masaru ID: 9000017578554

    Dept. of Mech. Syst. Eng., Toyama Prefectural University (2009年 CiNii収録論文より)

    CiNii収録論文: 1件

    • D314 STUDY ON P-Q CURVES OF COOLING FANS FOR THERMAL DESIGN OF ELECTRONIC EQUIPMENT : EFFECTS OF OPENING POSITION LOCATED IN FRONT OF A FAN(Components-3) (2009)
  • Ishizuka Masaru ID: 9000019291546

    CiNii収録論文: 1件

    • Thermal Analysis of a New High Density Package Cooling Technology Using Low Melting Point Alloys (1991)
  • Ishizuka Masaru ID: 9000019351215

    Department of Mechanics System Engineering, Toyama Prefectural University, Imizu, Toyama 939-0398, Japan (2012年 CiNii収録論文より)

    CiNii収録論文: 1件

    • Noninvasive In-vivo Measurements of Microvessels by Reflection-Type Micro Multipoint Laser Doppler Velocimeter (2012)
  • Ishizuka Masaru ID: 9000019404936

    CiNii収録論文: 1件

    • Numerical Simulation of a Sessile Bubble beneath a Horizontal Solid Wall in Liquid (2001)
  • Ishizuka Masaru ID: 9000019414904

    CiNii収録論文: 1件

    • New Package Cooling Technology Using Low Melting Point Alloys (1990)
  • Ishizuka Masaru ID: 9000019487212

    Mechanical Engineering Laboratory, R & D Center, Toshiba Corporation, Kawasaki-ku, Kawasaki 210 (1989年 CiNii収録論文より)

    CiNii収録論文: 1件

    • An Application of the Thermal Network Method to the Thermal Analysis of Multichip Packages (Proposal of a Simple Thermal Analysis Model) (1989)
  • ISHIZUKA Masaru ID: 9000020095233

    Dept. of Mechanical Systems Engineering, Toyama Prefectrural University (2011年 CiNii収録論文より)

    CiNii収録論文: 1件

    • Experimental and Thermal Network Study on the Performance of a Pins Studded Phase Change Material in Electronic Device Cooling (2011)
  • ISHIZUKA Masaru ID: 9000020622680

    Department of Mechanical Systems Engineering, Toyama Prefectural University (2011年 CiNii収録論文より)

    CiNii収録論文: 1件

    • Effects of Electronic Enclosure and Inlet Area on P - Q Curves of Installed Axial Cooling Fans (2011)
  • ISHIZUKA Masaru ID: 9000021123821

    CiNii収録論文: 1件

    • Aerodynamic Resistance of Perforated Plates in Natural Convection (1985)
  • ISHIZUKA Masaru ID: 9000021198297

    Department of Mechanical Systems Engineering, Toyama Prefectural University (2009年 CiNii収録論文より)

    CiNii収録論文: 1件

    • Effects of Wall Clearance of a Vertical Channel on Natural Air Cooling Capability (2009)
  • ISHIZUKA Masaru ID: 9000021314783

    Department of Mechanical Systems Engineering, Toyama Prefectural University (2009年 CiNii収録論文より)

    CiNii収録論文: 1件

    • Effect of Shape Parameters on Flow Resistance of Perforated Plates and the Flow Resistance Characteristic for Design of Natural Air Cooled Electronic Equipment (2009)
  • ISHIZUKA Masaru ID: 9000021414436

    CiNii収録論文: 1件

    • On the Cooling of Natural-air-cooled Electronic Equipment Casings : Proposal of a Practical Formula for Thermal Design (1986)
  • ISHIZUKA Masaru ID: 9000021439536

    CiNii収録論文: 1件

    • Transient Temperature Rise in Multi-chip Packages (1986)
  • Ishizuka Masaru ID: 9000021644306

    Toyama Prefectural University (2011年 CiNii収録論文より)

    CiNii収録論文: 1件

    • Electro-Thermal Analysis and Monte Carlo Simulation for Thermal Design of Si Devices (2011)
  • Ishizuka Masaru ID: 9000022207462

    Toyama Prefectural University (2010年 CiNii収録論文より)

    CiNii収録論文: 1件

    • Reduction of Thermal Resistance for Chip Test Technology by Using Super Thermal Conductivity Material and Mirror Finished Silicon (2010)
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