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Prediction of Thermal Deformation of Multi-Layered Substrate, and Its Application to Warpage Analysis of Package
[in Japanese]
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MATSUDA Kazutoshi
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IKEDA Toru
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MIYAZAKI Noriyuki
… In electronic packages such as a BGA package, decrease of package warpage in the temperature range where the package is used is a key issue in order to enhance the reliability of solder connection and to reduce the number of defective packages. … If we can predict the package warpage accurately in the design stage of electronic packaging by using a simulation method, we can make use of such a prediction to enhance the reliability of electronic packaging. …
Transactions of the Japan Society of Mechanical Engineers. A 76(762), 127-135, 2010-02-25
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