Search Results:　 1-20 of 153

1

Heat Transfer Engineering for Cooling of Electronic Equipment and Simple Thermal Analysis by Excel [in Japanese]

富村寿夫

ディスプレイ 18(10), 40-45, 2012-10-00
2

Heat Transfer by Natural Convection between Smooth Heated Plates [in Japanese]

INAGAKI Terumi , SHIRATO Tetsuro , OKABE Taro

本研究は，下流に向かって加速や減速を伴う加熱平板間の自然対流熱伝達について実験および数値シミュレーションの観点から検討を加えたものである．このような現象は，ハイブリッド外断熱建築構造物に付随する通気層内や大型電子デバイスの冷却装置内などさまざまな環境下で生起しており，それらの内部に誘起される自然対流の熱流体力学的な特性を解明しておくことが重要である．滑らかな垂直平行平板間に発達する自然対流の熱伝達 …

KAGAKU KOGAKU RONBUNSHU 37(3), 327-337, 2011-07-20

J-STAGE CrossRef References (12)
3

Morphology Effects on Space Charge Characteristics of Low Density Polyethylene

Zhou Yuanxiang , Wang Yunshan , Zahn Markus , Wang Ninghua , Sun Qinghua , Liang Xidong , Guan Zhichen

… Low density polyethylene (LDPE) film samples with different morphology were prepared by three kinds of annealing methods which were different in cooling rates in this study. … It was found that the lower cooling rate samples have higher crystallinity, more homo-charge accumulation, lower mobility and deeper trap depth. …

Jpn J Appl Phys 50(1), 017101-017101-8, 2011-01-25

The Japan Society of Applied Physics
4

Selection of Cooling Method in a Cabinet for Electronic Equipment [in Japanese]

杉浦伸明

愛知工科大学紀要 9, 31-36, 2011-00-00
5

Flow and Thermal Resistance Network Analysis of Airflow and Heat Transfer in a Thin Electronic Equipment Enclosure with a Localized Finned Heat Sink [in Japanese]

FUKUE Takashi , ISHIZUKA Masaru , YAMAZAKI Kenta , HATAKEYAMA Tomoyuki , NAKAGAWA Shinji , NAKAYAMA Wataru

… A model of electronic equipment considered in the present study has the characteristics that are commonly seen in modern compact electronic equipment. … The equipment box is so thin that cooling air is permitted only in a corner of the box where a finned heat sink (1 cm (H) x 2 cm (W) x 6 cm (L)) is installed on the board. …

Thermal Science and Engineering 19(3), 81-93, 2011

J-STAGE
6

Study on the Output Power Density of the Shape Memory Alloy Engine

SATO Yoshihisa , YOSHIMINE Kazuya , UCHIYAMA Genki , WATANABE Takayuki

… If the radius of the low temperature wheel (R) is determined, the equipment width (W) of the SMA engine is also determined (W=2R). … Next, the height of the SMA engine is determined experimentally by the cooling conditions of the SMA belt. …

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series B 77(782), 2037-2043, 2011

J-STAGE CrossRef
7

Effects of Electronic Enclosure and Inlet Area on P - Q Curves of Installed Axial Cooling Fans

FUKUE Takashi , KOIZUMI Katsuhiro , ISHIZUKA Masaru , NAKAGAWA Shinji

… This paper describes the effects of the enclosure and its inlet on the performance of axial air-cooling fans installed in electronic equipment. … The performance of an air-cooling fan is defined by its <I>P - Q</I> … curve of cooling fans depends on their operating environment. …

Journal of Environment and Engineering 6(3), 650-664, 2011

J-STAGE CrossRef
8

Study on Air Forced Convection Cooling Performance on a High Heat Density Board Model in a Thin Enclosure(Thermal Engineering) [in Japanese]

FUKUE Takashi , ISHIZUKA Masaru , NAKAGAWA Shinji , HATAKEYAMA Tomoyuki , SHIMOUCHI Tomoya , NAKAYAMA Wataru

… This paper describes air cooling performance for electronic circuit boards set in the thin enclosure, where cooling air flow pass is very narrowed by many mounted devices. … To discuss the cooling performance in the thin enclosure, we designed a test enclosure model which is composed of a model cardboard including 5 heat sources and a narrow heatsink duct and inspected a temperature rise of the model board and heat sources. …

Transactions of the Japan Society of Mechanical Engineers. B 76(771), 1884-1892, 2010-11-25

CiNii Fulltext PDF - Open Access References (19) Cited by (1)
9

C113 Forced-Convection Heat Transfer Characteristics of Pulsating Microencapsulated Phase Change Material Suspensions in a Mini-pipe [in Japanese]

Hayashi Tatsuya , Nakagawa Shinji , Ishizuka Masaru , Hatakeyama Tomoyuki

… Fundamental thermal performance of a liquid cooling system for small electronic equipment has been studied. … A liquid cooling system is attracting attention because an increase of heat generation density in electronic components requires effective cooling. …

Procee[d]ings of Thermal Engineering Conference 2010, 65-66, 2010-10-29

CiNii Fulltext PDF - Subscription
10

Study on Performance Prediction Model of Cooling Fans for Thermal Design of Electronic Equipment : Modeling and Evaluation of Effects from Electronic Enclosure and Inlet Sizes [in Japanese]

FUKUE Takashi , KOIZUMI Katsuhiro , ISHIZUKA Masaru , NAKAGAWA Shinji , HATAKEYAMA Tomoyuki

… This study describes the fan performances such as the P-Q curve and the maximum flow rate at various environmental conditions where the cooling fan is installed. … Especially, this paper focuses on the relationship between the fan performance and the configuration factors such as the electronic enclosure. …

Thermal Science and Engineering 18(4), 115-125, 2010-10-01

J-STAGE References (17)
11

J0601-2-5 Application of a Thermal Network Method to the Thermal Analysis inside a Thin Electronic Equipment Model [in Japanese]

YAMAZAKI Kenta , FUKUE Takashi , ISHIZUKA Masaru , HATAKEYAMA Tomoyuki , NAKAGAWA Shinji , NAKAYAMA Wataru

… This paper describes a thermal network analysis of an electronic circuit board set in the thin enclosure, where cooling air flow pass is very narrowed by many mounted devices. … Especially, we discuss the accuracy temperature rise distribution of the board depending on cooling performance of a heatsink. …

年次大会講演論文集 : JSME annual meeting 2010(7), 259-260, 2010-09-04

CiNii Fulltext PDF - Subscription
12

J0601-2-1 An Operation Method of Fan Performance Curves at CFD Codes [in Japanese]

FUKUE Takashi , KOIZUMI Katsuhiro , ISHIZUKA Masaru , HATAKEYAMA Tomoyuki , NAKAGAWA Shinji

This paper describes how to use the fan performance curve for a CFD code. With the fan performance curve, a flow rate corresponded to a pressure difference between the forward and backward of the fan …

年次大会講演論文集 : JSME annual meeting 2010(7), 251-252, 2010-09-04

CiNii Fulltext PDF - Subscription
13

J0601-1-4 Theoretical Study on Thermal Contact Resistance between Solid Surfaces : Effect of Waviness on Contraction of Heat Flow [in Japanese]

TOMIMURA Toshio , KOITO Yasushi , ISHIZUKA Masaru , HATAKEYAMA Tomoyuki

… To minimize the volume and weight of electronic systems like spacecraft, aircraft and computers, the systems are packed with high-density electronic devices. … Under such a high heat dissipation density, thermal contact conductance plays an important role in cooling of electronic equipment. …

年次大会講演論文集 : JSME annual meeting 2010(7), 245-246, 2010-09-04

CiNii Fulltext PDF - Subscription
14

Reduction in Flow Rate of Small Cooling Fans by an Obstruction(Fluids Engineering) [in Japanese]

NAKAMURA Hajime , FUKUE Takashi , KOIZUMI Katsuhiro , ISHIZUKA Masaru

… A compact air-cooling device often encounters high-density mounting environment, which may reduce a flow-rate of a cooling fan. … In this work, the PQ characteristics of a cooling fan was investigated which varied by placing an obstacle in close proximity of a fan. …

Transactions of the Japan Society of Mechanical Engineers. B 76(768), 1184-1190, 2010-08-25

CiNii Fulltext PDF - Open Access References (8)
15

The Optimum Dimension of the Wall Clearance of a Vertical Channel for Natural Cooling [in Japanese]

NISHINO Yasushi , ISHIZUKA Masaru , NAKAGAWA Shinji

… Natural cooling capability in a vertical channel modeling compact electronic equipment was investigated by experiment and numerical simulation. … The effects of the clearance between the heating walls on the natural cooling capability were discussed. …

Thermal Science and Engineering 18(2), 35-43, 2010-04-01

J-STAGE References (9)
16

401 The P-Q curve change of the axial fan caused by the opening position in front of the fan [in Japanese]

Fukue Takashi , Koizumi katsuhiro , Ishizuka Masaru , Kanasaki Tomoki , Hatakeyama Tomoyuki , Nakagawa Shinji

講演論文集 2010(47), 123-124, 2010-03-05

CiNii Fulltext PDF - Subscription
17

D314 STUDY ON P-Q CURVES OF COOLING FANS FOR THERMAL DESIGN OF ELECTRONIC EQUIPMENT : EFFECTS OF OPENING POSITION LOCATED IN FRONT OF A FAN(Components-3)

FUKUE Takashi , KOIZUMI Katsuhiro , HATAKEYAMA Tomoyuki , ISHIZUKA Masaru , NAKAGAWA Shinji

… This paper describes the relationship between fan performance and configuration factors such as flow inlet porosity of an electronic enclosure, or flow obstacles which imitate high-density packages and restricted flow area configurations for a development of a fan performance prediction model. … We focus on an electronic enclosure or an obstacle in front of the fan individually as factors which have dominant effects to the fan. …

Proceedings of the International Conference on Power Engineering : ICOPE 2009(3), "3-259"-"3-264", 2009-11-16

CiNii Fulltext PDF - Subscription
18

F132 Cooling Performance at Local Forced Convection Electronic Devices with the Axial Cooling Fan [in Japanese]

Fukue Takashi , Ishizuka Masaru , Nakagawa Shinji , Hatakeyama Tomoyuki , Nakayama Watara

… This paper describes air cooling performance which is driven by axial cooling fans for electronic circuit boards set in the thin enclosure, where cooling air flow pass is very narrowed by many mounted devices. …

Procee[d]ings of Thermal Engineering Conference 2009, 163-164, 2009-11-06

CiNii Fulltext PDF - Subscription
19

1506 Study on the Cooling Performance for a Sealed Natural Air Cooled Casing : Effects of Heater Positions [in Japanese]

HIOKI Yusuke , ISHIZUKA Masaru , NAKAGAWA Shinji , HATAKEYAMA Tomoyuki

The Computational Mechanics Conference 2009(22), 714-715, 2009-10-10

CiNii Fulltext PDF - Subscription
20

1505 Prediction Accuracy of Cooling Performance at Local Forced Convection Electronic Devices [in Japanese]

FUKUE Takashi , YAMAZAKI Kenta , ISHIZUKA Masaru , NAKAGAWA Shinji , HATAKEYAMA Tomoyuki , NAKAYAMA Wataru

… This paper describes air cooling performance for electronic circuit boards set in the thin enclosure, where cooling air flow pass is very narrowed by many mounted devices. …

The Computational Mechanics Conference 2009(22), 712-713, 2009-10-10

CiNii Fulltext PDF - Subscription

Search Results:　 1-20 of 153

Related Authors

Related Journals

Search Results: 1-20 of 153

Related Authors

Related Journals

Search Results:　 1-20 of 153