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Study on Air Forced Convection Cooling Performance on a High Heat Density Board Model in a Thin Enclosure(Thermal Engineering)
[in Japanese]
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FUKUE Takashi
,
ISHIZUKA Masaru
,
NAKAGAWA Shinji
,
HATAKEYAMA Tomoyuki
,
SHIMOUCHI Tomoya
,
NAKAYAMA Wataru
… On the other hand, natural convection and radiation from the enclosure also have an important effect to heat release in the high-density packaging device. … However, by the effect of forced convection cooling, temperature rise of components is decreased of 20℃ as compared to the result without air flow. … Therefore, local forced convection by the narrow duct is effective for the heat release from the high-packaging density device. …
Transactions of the Japan Society of Mechanical Engineers. B 76(771), 1884-1892, 2010-11-25
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References (19)
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