Durability of Polyimide Printed Circuit Board under High Temperature and High Humidity.

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  • OGAWA Toshio
    Laboratory for Mtaterial Design Engineering, Kanazawa Institute of Techology
  • KURATANI Atsushi
    Laboratory for Mtaterial Design Engineering, Kanazawa Institute of Techology
  • OSAWA Satoshi
    Laboratory for Mtaterial Design Engineering, Kanazawa Institute of Techology
  • INOUE Hiroshi
    Polymer Laboratory, Corporate Research & Development, Ube Industries, Ltd.

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Other Title
  • ポリイミド製プリント基板の高温高湿度下における耐久性
  • ポリイミドセイ プリント キバン ノ コウオン コウ シツドカ ニ オケル タ

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Abstract

The cause of deterioration in PCB (printed circuit board) is due to the migration of copper ion. We carried out bias test under high temperature and high humidity, and discussed the deterioration of PCB due to ionic migration. Some compounds were added in adhesive as impurity and the two adhesives having different glass transition temperature were used to adhere copper with polyimide film. The development of the ionic migration resulted in the decrease of deterioration time. The deterioration time became short with the increase of impurity content and with the decrease of glass transition temperature.

Journal

  • Materials life

    Materials life 10 (2), 85-92, 1998

    MATERIALS LIFE SOCIETY, JAPAN

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