金属箔を用いたMo焼結体の接合 Bonding of Sintered Mo Powder Compacts Used Metal Foils
Bonding test of sintered go powder compacts has been done by using Ni, Au, Pt and Pd metal foils. As the result, it was confirmed that sintered Mo powder compacts inserted by Ni, Pt and Pd foils well bonded each other at 1300°C, which may be due to the diffusion of Mo to the metal foils. In the case of using Au foils, the well-bonding was also observed by heating above melting temperature of Au, which indicates that Au diffuses into Mo powder compacts.
粉体および粉末冶金 43(3), 358-363, 1996-03-15
Japan Society of Powder and Powder Metallurgy