Fabrication and Thermal Properties of Polyimide/Cu Functionally Graded Material.

• Omori Mamoru

  Institute for Materials Research, Tohoku University

• Okubo Akira

  Institute for Materials Research, Tohoku University

• Hirai Toshio

  Institute for Materials Research, Tohoku University

書誌事項

タイトル別名

• Fabrication and Thermal Properties of P

抄録

Thermal conductive composites were formed from thermoplastic polyimide and A1N powders, and functionally graded materials (FGMs) were fabricated from those composites and Cu powder using a spark plasma system. A high pressure of 245 MPa was required to obtain dense composites whose thermal conductivity was more than 10 W/m.K. The thermal conductivity of FGMs prepared at 39.2 and 245 MPa was 35 and 60 W/m.K.

収録刊行物

• 粉体および粉末冶金

  粉体および粉末冶金 45 (3), 216-219, 1998

  一般社団法人 粉体粉末冶金協会

キーワード

• thermoplastic polyimide
• functionally graded material
• spark plasma system
• thermal conductivity
• residual stress
• thermal expansion mismatch

詳細情報

• CRID: 1390282681284073856
• NII論文ID: 10002015183
• NII書誌ID: AN00222724
• DOI: 10.2497/jjspm.45.216
• ISSN: 18809014
• ISSN: 05328799
• NDL書誌ID: 4447663
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I4447663
• 本文言語コード: en
• データソース種別:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles
• 抄録ライセンスフラグ: 使用不可