パルス通電加圧焼結法による高融点金属の接合 Bonding of Refractory Metals by Plasma Activated Sintering

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Plasma activated sintering (PAS) is a kind of hot pressing method. This sintering method is usually for powder sintering. But, it is very effective method for bonding of refractory metals to refractory metals such as tungsten, too. Purpose of this research is to make the ion gun parts (arc chamber) of ion implantation devices by bonding method. Usually, molybdenum is used for the parts. With increasingly high integration in IC memory, the problem of contamination of wafer due to molybdenum arose and therefore the parts made of tungsten are preferred by the industries. However, tungsten is too hard to be formed into the parts by conventional machining process.<BR>The bonded joints of tungsten in the different bonding conditions (temperature, pressure, without interlayer, with interlayer of tungsten or tantalum powder) were evaluated by an optical microscope, an ultrasonic imaging and four point bending test. As a result, bending strength of the joints with interlayer of tantalum powder, tungsten powder and without any interlayer was measured to be about 400, 200 and 100MPa, respectively.

収録刊行物

  • 粉体および粉末冶金  

    粉体および粉末冶金 45(10), 915-919, 1998-10-15 

    Japan Society of Powder and Powder Metallurgy

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各種コード

  • NII論文ID(NAID)
    10002052931
  • NII書誌ID(NCID)
    AN00222724
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    05328799
  • NDL 記事登録ID
    4585453
  • NDL 雑誌分類
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL 請求記号
    Z17-274
  • データ提供元
    CJP書誌  NDL  J-STAGE 
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