Equilibrium shapes of axisymmetric liquid solder menisci around a vertical cylinder on a horizontal substrate.
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- Gu Yongan
- Department of Mechanical Engineering, University of Alberta
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- Li Dongqing
- Department of Mechanical Engineering, University of Alberta
書誌事項
- タイトル別名
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- Equilibrium Shapes of Axisymmetric Liqu
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In this paper, equilibrium shapes of axisymmetric liquid solder joint menisci around a vertical cylinder on a horizontal plane substrate were calculated by numerically solving the Laplace equation of capillarity. The boundary conditions are the contact angles formed with the cylinder and with the substrate, subject to the prescribed liquid solder volume constraint. Numerical solutions were obtained by implementing the 4th-order Runge-Kutta technique and the Shooting Method simultaneously. For a given solder volume, the equilibrium shapes of axisymmetric solder menisci, the capillary height on the cylinder and the radius of the wetted circle on the substrate are sensitive to the contact angles. Except the vertical wetted area on the cylinder, the horizontal wetted area on the substrate and the cross-section area of the axisymmetric meniscus were found to be approximately linear functions of the liquid solder volume in a small range. Finally, the effects of cylinder radius on the equilibrium shapes and on the both wetted areas were studied.
収録刊行物
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- JOURNAL OF CHEMICAL ENGINEERING OF JAPAN
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JOURNAL OF CHEMICAL ENGINEERING OF JAPAN 30 (2), 302-309, 1997
公益社団法人 化学工学会
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詳細情報 詳細情報について
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- CRID
- 1390001204565319040
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- NII論文ID
- 130000020872
- 10002062673
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- NII書誌ID
- AA00709658
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- COI
- 1:CAS:528:DyaK2sXivVGlurw%3D
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- ISSN
- 18811299
- 00219592
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- NDL書誌ID
- 4209580
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- 本文言語コード
- en
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- データソース種別
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可