Ｐｂフリーはんだ用Ｓｎ‐Ａｇ合金めっき

• 新井 進

  長野県精密工業試験場

• 渡辺 徹

  東京都立大学工学部

書誌事項

タイトル別名

• Sn-Ag Alloy Electroplating for Use as Pb-Free Solder.
• Pb フリー ハンダヨウ Sn-Ag ゴウキン メッキ

抄録

We studied the effects of electrodeposition conditions on Sn-Ag alloy composition and current efficiency in Pb-free solder plating employing a new pyrophosphate-iodide bath. We also investigated the morphology, phase structure, thermal characteristics and solderability of electroplated Sn-Ag alloy films. Ag content in deposits decreased with increasing current density during both agitation and nonagitation, Sn-Ag electroplated films containing between 2.0 and 20.0 at% silver consisted of β-Sn and the ε phases, β-Sn phase orientation in electrodeposited Sn-Ag alloy films became random with increasing ε phase content. The melting point, i.e., the temperature at which melting first occurred, of electroplated Sn-Ag alloy films was 221°C. Wetting time of electroplated Sn-Ag alloy films became minimum at a near Sn-Ag eutectic composition and was not affected by thickness from 0.5 to 10μm.

収録刊行物

• 表面技術

  表面技術 49 (1), 73-77, 1998

  一般社団法人 表面技術協会

キーワード

• Pb Free Solder
• Electroplating
• Sn-Ag Alloy
• Solderability

詳細情報

• CRID: 1390001204114461440
• NII論文ID: 10002108520
• NII論文ID: 10008848885
• NII書誌ID: AN1005202X
• DOI: 10.4139/sfj.49.73
• COI: 1:CAS:528:DyaK1cXpvVKgsw%3D%3D
• ISSN: 18843409
• ISSN: 09151869
• ISSN: http://id.crossref.org/issn/09151869
• NDL書誌ID: 4367227
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I4367227
• 本文言語コード: ja
• データソース種別:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles
• 抄録ライセンスフラグ: 使用不可