ピロリン酸浴からのPd-Sn合金めっきにおけるジエチレントリアミン五酢酸の影響 Diethylenetriaminepentaacetic Acid Effects on Pd-Sn Alloy Electrodeposition from Pyrophosphate Baths
Pd-Sn alloy plating was studied in agitated baths containing 1.0mol/LK<sub>4</sub>P<sub>2</sub>O<sub>7</sub>, 0.03mol/L Pd(NH<sub>3</sub>)<sub>2</sub>Cl<sub>2</sub>, 0.5mol/L K<sub>2</sub>SnO<sub>3</sub>, and 0.7mol/L KNO<sub>2</sub> with and without 0.15mol/L diethylenetriaminepentaacetic acid (DTPA). Addition of DTPA as reflected in current density-potential curves suggests that Pd<sup>2+</sup> forms a stable Pd(DTPA)<sup>3-</sup> complex, and Sn<sup>4+</sup> coexists in the bath with DTPA as pyrophosphate complexes. Current efficiency and Sn content in deposits increases with pH and current density. Deposit morphology revealed a rough grain when pH was ≥11.0 and current density was >3.0A/dm<sup>2</sup>. A dense, smooth Pd-19mass%Sn alloy deposit forming a solid solution was obtained at 2.0A/dm<sup>2</sup> from a bath containing DTPA.
- 表面技術 = The Journal of the Surface Finishing Society of Japan
表面技術 = The Journal of the Surface Finishing Society of Japan 49(1), 78-83, 1998-01-01
The Surface Finishing Society of Japan