Environment Administration and Substitute Technology. Development of Pb Free Solder Plating.

• KOYANO Hidekatsu

  TOHTEC Co., Ltd.

Bibliographic Information

Other Title

• 環境規制と代替技術　　Ｐｂフリーはんだめっきの現状
• Pb フリー ハンダ メッキ ノ ゲンジョウ

Journal

• Journal of The Surface Finishing Society of Japan

  Journal of The Surface Finishing Society of Japan 49 (3), 235-241, 1998

  The Surface Finishing Society of Japan

Keywords

• Pb Free Solder
• Sn Alloy Plating
• Sn-Ag
• Sn-Bi
• Sn-Zn

Details

• CRID: 1390001204114930688
• NII Article ID: 10002108660
• NII Book ID: AN1005202X
• DOI: 10.4139/sfj.49.235
• ISSN: 18843409
• ISSN: 09151869
• NDL BIB ID: 4413772
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I4413772
• Text Lang: ja
• Data Source:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles