溶融塩電析によるNiシリサイド膜の作製とその高温耐食性 Molten Salt Electrodeposition of Ni Silicide Film and Hot Corrosion Resistance

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抄録

A Ni suicide layer on Ni substrate was formed by electrodepositing Si and alloying it with Ni in molten salt. Electrolysis was conducted using potentiostatic polarization at constant potentials in an equimolar NaCl-KCl melt containing 5mol% K<sub>2</sub>SiF<sub>6</sub> at 1023K. The maximum mass of electrodeposited material was obtained at -1.3V (vs. Ag/Ag<sup>+</sup>(0.1)). Deposits formed at -1.2 to -1.5V were conical or cylindrical surface crystals and film-like material beneath crystals. Such deposits consist of Ni silicides such as α-NiSi<sub>2</sub>, NiSi and ε-Ni<sub>3</sub>Si<sub>2</sub>. Si content in deposits decreased with increasing depth from the surface to the deposit/substrate interface. Nickel covered by the electrodeposit was more resistant than bare nickel to hot corrosion by molten Na<sub>2</sub>SO<sub>4</sub>.

収録刊行物

  • 表面技術 = The Journal of the Surface Finishing Society of Japan  

    表面技術 = The Journal of the Surface Finishing Society of Japan 49(5), 507-513, 1998-05-01 

    The Surface Finishing Society of Japan

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各種コード

  • NII論文ID(NAID)
    10002109330
  • NII書誌ID(NCID)
    AN1005202X
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    09151869
  • NDL 記事登録ID
    4481830
  • NDL 雑誌分類
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL 請求記号
    Z17-291
  • データ提供元
    CJP書誌  NDL  J-STAGE 
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