溶融塩電析によるNiシリサイド膜の作製とその高温耐食性 Molten Salt Electrodeposition of Ni Silicide Film and Hot Corrosion Resistance
A Ni suicide layer on Ni substrate was formed by electrodepositing Si and alloying it with Ni in molten salt. Electrolysis was conducted using potentiostatic polarization at constant potentials in an equimolar NaCl-KCl melt containing 5mol% K<sub>2</sub>SiF<sub>6</sub> at 1023K. The maximum mass of electrodeposited material was obtained at -1.3V (vs. Ag/Ag<sup>+</sup>(0.1)). Deposits formed at -1.2 to -1.5V were conical or cylindrical surface crystals and film-like material beneath crystals. Such deposits consist of Ni silicides such as α-NiSi<sub>2</sub>, NiSi and ε-Ni<sub>3</sub>Si<sub>2</sub>. Si content in deposits decreased with increasing depth from the surface to the deposit/substrate interface. Nickel covered by the electrodeposit was more resistant than bare nickel to hot corrosion by molten Na<sub>2</sub>SO<sub>4</sub>.
- 表面技術 = The Journal of the Surface Finishing Society of Japan
表面技術 = The Journal of the Surface Finishing Society of Japan 49(5), 507-513, 1998-05-01
The Surface Finishing Society of Japan