水晶振動子マイクロバランス(QCM)法を用いたAgおよびCuのマイグレーション過程の検討 [in Japanese] Investigation of Ag and Cu Migration Process Using Quartz Crystal Microbalance [in Japanese]
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Migration is the short-circuiting between electrodes on printed circuit boards, often observed in the presence of moisture, that reduces electronics reliability. Migration has been assumed to be due to anodic dissolution and cathodic deposition, but quantitative and <i>in situ</i> monitoring of the process is difficult. We used a quartz crystal microbalance (QCM) to study migration, and found that anodic dissolution and cathodic deposition increase over time until short-circuiting occurs, but surpressed thereafter.
- Jitsumu Hyomen Gijutsu
Jitsumu Hyomen Gijutsu 49(5), 514-518, 1998-05-01
The Surface Finishing Society of Japan