Sn不純物を含む銅電析皮膜のTEMならびにESCA観察 TEM and ESCA Observations of Copper Deposits Containing Tin Impurities

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TEM and ESCA observations have been used to study copper crystallite sizes, tin and oxygen atom concentration distributions, tin oxidation, and the crystal structure of tin oxide, compared to electrolytic polycrystalline copper deposits with no impurity atoms (pure copper deposits). The 0.003wt%Sn-Cu alloy deposited in a copper electrolyte containing a tin additive of 1g/dm<sup>3</sup> showed almost the same results as the pure copper deposit. For the 1.10wt%Sn-Cu alloy produced in an electrolyte containing a tin additive of 10g/dm<sup>3</sup>, tin atoms were found to be incorporated into copper deposits in both metallic and oxidation states. Tin oxide particles (SnO<sub>2</sub>) having a rutile (or C4) tetragonal structure were observed to be a smooth and elliptical, 2-5nm in size, and almost homogeneously dispersed as clusters of several particles inside copper deposits.<br>We also sound in nm-order SnO<sub>2</sub> particle incorporation that particles form in the copper electrolyte and are concomitantly introduced into copper deposits during alloy electrodeposition.

収録刊行物

  • 表面技術 = The Journal of the Surface Finishing Society of Japan  

    表面技術 = The Journal of the Surface Finishing Society of Japan 49(5), 519-524, 1998-05-01 

    The Surface Finishing Society of Japan

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各種コード

  • NII論文ID(NAID)
    10002109351
  • NII書誌ID(NCID)
    AN1005202X
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    09151869
  • NDL 記事登録ID
    4481832
  • NDL 雑誌分類
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL 請求記号
    Z17-291
  • データ提供元
    CJP書誌  NDL  J-STAGE 
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