Sn-Ag Alloy Electrodeposition from L-Tartrate Complex Bath.

• NAWAFUNE Hidemi

  Fac. of Sci., Konan Univ.

• IKEDA Kazuki

  Fac. of Sci., Konan Univ.

• KITAMURA Hiroshi

  Fac. of Sci., Konan Univ.

• MIZUMOTO Shozo

  Fac. of Sci., Konan Univ.

• TAKEUCHI Takao

  DAIWA FINE CHEMICALS Co., Ltd.

• AOKI Kazuhiro

  ISHIHARA Chemical Co., Ltd.

Bibliographic Information

Other Title

• Ｌ‐酒石酸錯体浴からのスズ‐銀合金めっき
• L シュセキサン サクタイヨク カラ ノ スズ ギン ゴウキンメッキ

Abstract

Electrodeposited tin-silver alloys show promise as lead-free alternatives to solder coating. Eutectic tinsilver alloy film was deposited at 2∼3A/dm², 25°C, and pH 8 using the following bath composition: 0.19M SnCl₂, 0.01M CH₃COOAg, 1.0M L-tartaric acid, and 0.2M N-acetyl-L-cysteine. The presence of N-acetyl-L-cysteine markedly promoted silver deposition over a noble potential range.<br>The eutectic tin-silver alloy film consisted of β-Sn and ε (Ag₃Sn) phases, and its solidus temperature was 221°C. An intermetallic compound layer (Cu₆Sn₅) was formed at the interface of the alloy film and copper substrate in heat treatment, forming a Sn-Ag-Cu ternary eutectic (m. p. 217°C) with reactions of Cu₆Sn₅ and ε (Ag₃Sn) phases.

Journal

• Journal of The Surface Finishing Society of Japan

  Journal of The Surface Finishing Society of Japan 49 (7), 759-763, 1998

  The Surface Finishing Society of Japan

Keywords

• Pb-Free Solder Plating
• Sn-Ag Alloy
• L-Tartrate Complex Bath
• N-Acetyl-L-Cysteine

Details

• CRID: 1390282679092178304
• NII Article ID: 10002109985
• NII Article ID: 10007792894
• NII Book ID: AN1005202X
• DOI: 10.4139/sfj.49.759
• COI: 1:CAS:528:DyaK1cXksFOnsbg%3D
• ISSN: 18843409
• ISSN: 09151869
• ISSN: http://id.crossref.org/issn/09151869
• NDL BIB ID: 4514778
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I4514778
• Text Lang: ja
• Data Source:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles
• Abstract License Flag: Disallowed