What's Will Be the Future of Assembly and Packaging Technology?

• HATADA Kenzo

  Atomnics Laboratory Inc.

Bibliographic Information

Other Title

• 半導体技術からみた実装技術
• ハンドウタイ ギジュツ カラ ミタ ジッソウ ギジュツ

Journal

• Journal of The Surface Finishing Society of Japan

  Journal of The Surface Finishing Society of Japan 49 (8), 826-830, 1998

  The Surface Finishing Society of Japan

Keywords

• Assembly
• Packaging
• System LSI
• 3-D Assembly Technology

Details

• CRID: 1390282679091908480
• NII Article ID: 10002110158
• NII Book ID: AN1005202X
• DOI: 10.4139/sfj.49.826
• ISSN: 18843409
• ISSN: 09151869
• NDL BIB ID: 4546122
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I4546122
• Text Lang: ja
• Data Source:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles