New Technologies for Scaled-down Cu Interconnection in Ultra-Large Scale Integrated Circuits. Prospects on Copper Plating Systems for Ultra-large Scale Integrated Circuits.
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- NAWAFUNE Hidemi
- Fac. of Sci., Konan Univ.
Bibliographic Information
- Other Title
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- ULSI微細Cu配線技術の新しい展開 湿式銅めっき法によるULSI配線技術の課題
- シッシキ ドウメッキ ホウ ニ ヨル ULSI ハイセン ギジュツ ノ カダイ
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Journal
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- Journal of The Surface Finishing Society of Japan
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Journal of The Surface Finishing Society of Japan 49 (11), 1180-1184, 1998
The Surface Finishing Society of Japan
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Details 詳細情報について
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- CRID
- 1390001204114065280
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- NII Article ID
- 10002111014
- 10007235177
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- NII Book ID
- AN1005202X
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- COI
- 1:CAS:528:DyaK1cXnsFyqtr4%3D
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- ISSN
- 18843409
- 09151869
- http://id.crossref.org/issn/09151869
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- NDL BIB ID
- 4603779
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles