パラジウムめっきリードフレームの曲げ特性に及ぼす下地ニッケルめっきの析出条件の影響

書誌事項

タイトル別名
  • Influence of Nickel Plating Uuderlayer Deposition Conditions on Bending Characteristics of Palladium Plating Leadframe.
  • パラジウムメッキ リードフレーム ノ マゲ トクセイ ニ オヨボス シタジ ニ

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抄録

In the palladium plating leadframe, nickel and palladium are plated over the whole surface including outerleads in the leadframe manufacturing process. Users have pointed out plating film cracks after bending of outerleads. The most thickness of the plating film is nickel.<br>We changed nickel plating conditions and studied the influence on plating film cracks, with the following results: (1) Nickel plating film from a sulfamate bath produces fewer cracks than that from a Watt's bath and is suitable for the underlayer of palladium plating film. (2) Internal stress in nickel plating film rises abruptly when the sulfamate bath pH exceeds 5.0. Even then, cracks did not grow larger, indicating no correlation between internal stress and crack extent. (3) Plating conditions should be monitored to maintain plating thickness because current efficiency changes with plating conditions. Their influence on cracks is small.

収録刊行物

  • 表面技術

    表面技術 49 (12), 1283-1290, 1998

    一般社団法人 表面技術協会

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