A Very Stable Non-cyanide Electroless Gold Plating Bath Using Thiourea and hydroquinone as a Cooperating Double Reductant System.
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- INOUE Takashi
- Hitachi Ltd. PERL.
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- ANDO Setsuo
- Hitachi Ltd. PERL.
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- USHIO Jiro
- Hitachi Ltd., Central Research Lab.
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- OKUDAIRA Hiroaki
- Hitachi Ltd. PERL.
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- TAKEHARA Hiroko
- Hitachi Ltd. PERL.
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- OTA Toshihiko
- Hitachi Ltd., General Purpose Computer Div.
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- YAMAMOTO Hiroshi
- Hitachi Chemical Co., Ltd., Shimodate Works
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- YOKONO Hitoshi
- Nippon Denkai Ltd.
Bibliographic Information
- Other Title
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- チオ尿素‐ヒドロキノン2元還元剤系を用いた極めて安定な非シアン無電解金めっき浴
- チオ ニョウソ ヒドロキノン 2ゲン カンゲンザイケイ オ モチイタ キワメテ
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Abstract
The paper reports a new autocatalytic electroless gold plating bath that achieves almost neutral, low temperature bath conditions and excellent process stability without cyanide. The bath contains a thiosulfatesulfite mixed complex of Au (I) as the gold source and two reducing agents, thiourea and hydroquinone. The thiourea acts as the primary reductant for the gold complex, while the hydroquinone recycles thiourea by reducing the intermediate thiyl radical derived from thiourea oxidation. Therefore hydroquinone functions as a thiourea regenerator. This unique cooperative reductant system offers superb bath stability. The bath has been applied not only to the most advanced mainframe MLC boards but also to a variety of very fine pitch organic PWBs manufacturing process.
Journal
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- Journal of The Surface Finishing Society of Japan
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Journal of The Surface Finishing Society of Japan 49 (12), 1298-1304, 1998
The Surface Finishing Society of Japan
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Details 詳細情報について
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- CRID
- 1390282679092431360
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- NII Article ID
- 10002111244
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- NII Book ID
- AN1005202X
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- COI
- 1:CAS:528:DyaK1MXis1WisA%3D%3D
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- ISSN
- 18843409
- 09151869
- http://id.crossref.org/issn/09151869
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- NDL BIB ID
- 4624037
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed