ポリイミドフィルム上へのレーザー照射無電解金めっき Laser-Enhanced Electroless Gold Plating on Polyimide Resin Film
Laser-enhanced electroless gold plating on polyimide resin plate was conducted in a cyanide-free bath. Electroless gold plating on polyimide resin was possible when a breakage protector such as a ceramic or copper plate was set behind the resin plate. The protector acts as a heat scatterer. Using a copper protector with higher heat conductivity produced a better gold deposit than using the ceramic plate.
- 表面技術 = The Journal of the Surface Finishing Society of Japan
表面技術 = The Journal of the Surface Finishing Society of Japan 49(12), 1305-1309, 1998-12-01
The Surface Finishing Society of Japan