5, 5-ジメチルヒダントインを用いたアルカリ系Sn-Ag合金めっき浴の検討 [in Japanese] Investigation for Alkaline Electroplating Bath of Sn-Ag Alloy Using 5, 5-Dimethylhydantoin [in Japanese]
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We studied the development of alkaline and electroplating baths of Sn-Ag binary alloy using 5, 5-dimethylhydantoin (DMHy) as a Pb-free solder plating bath under various conditions, such as metal content, complex agent concentration, pH, current density and bath temperature. From these results, <i>e. g</i>., adding large amount of DMHy, pH 10.5, high current density, etc., electroplating films of Sn-Ag alloy having eutectic and constant composition were obatined. Surface morphology and solder wetting time of Sn-Ag alloy electroplating films become roughened with increasing film thickness. The melting point of Sn-Ag alloy electroplating films was about 221°C, similar to that of Sn-Ag ingot, and its phase structure consisted of eutetic structure of β-Sn and the ε phase (Ag<sub>3</sub>Sn).
- Jitsumu Hyomen Gijutsu
Jitsumu Hyomen Gijutsu 49(12), 1310-1315, 1998-12-01
The Surface Finishing Society of Japan