クエン酸アンモニウム‐ヨウ化カリウム浴からのＳｎ‐Ａｇ合金めっきにおけるアノードの挙動

• 藤原 裕

  大阪市立工業研究所

• 楢原 泰栄子

  キザイ (株)

• 榎本 英彦

  大阪市立工業研究所

• 船田 清孝

  キザイ (株)

• 小見 崇

  大阪府立大学工学部

書誌事項

タイトル別名

• Anode Behaviors in Sn-Ag Alloy Plating from Ammonium Citrate-potassium Iodide Baths.
• クエンサン アンモニウム ヨウカ カリウムヨク カラ ノ Sn-Ag ゴウキン

抄録

Anodic current density-potential curves of Sn, Ag, Pt, and graphite were measured to obtain informations on the selection of anode materials in ammonium citrate-potassium iodide baths for Sn-Ag alloy plating. The Sn anode was dissolved at small overpotentials in ammonium citrate solutions containing iodide and showed a very smooth electrode surface. However, a displacement deposition of rough Ag was observed when solutions contained Ag⁺. The Ag anode also dissolved at small overpotentials. Nevertheless, AgI was precipitated at the anode and therefore the limiting current densities were smaller than 10mA/cm². The main electrode reaction at the Pt and graphite anode was oxidation of iodide to form I₃^-. This reaction also occurred at the Sn and Ag anode at high overpotentials. Sn²⁺ species was chemically oxidized by I₃^- formed at the anode, accumulating Sn⁴⁺ species in baths. To prevent both Ag displacement deposition and anodic oxidation of iodide, the electrode potential of the anode in Sn-Ag alloy plating baths must be maintained between -0.2V and 0.4V vs. NHE.

収録刊行物

• 表面技術

  表面技術 49 (12), 1316-1321, 1998

  一般社団法人 表面技術協会

キーワード

• Alloy Plating
• Sn-Ag Alloy
• Anode Material
• Iodide
• Pb-free Soldering

詳細情報

• CRID: 1390001204115734912
• NII論文ID: 10002111297
• NII論文ID: 10008848887
• NII書誌ID: AN1005202X
• DOI: 10.4139/sfj.49.1316
• COI: 1:CAS:528:DyaK1MXis1Witw%3D%3D
• ISSN: 18843409
• ISSN: 09151869
• ISSN: http://id.crossref.org/issn/09151869
• NDL書誌ID: 4624040
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I4624040
• 本文言語コード: ja
• データソース種別:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles
• 抄録ライセンスフラグ: 使用不可