ギ酸を還元剤とするモノアミノジカルボン酸錯体浴からの無電解パラジウムめっき Electroless Palladium Plating from Monoaminodicarboxylic Acid Complex Bath Using Formic Acid as a Reducing Agent
An electroless Palladium plating aiming "no emission" were investigated using formic acid as the reducing agent, and monoaminodicarboxylic acid as the complexing agent. Stability constants of Pd<sup>2+</sup> complexes are log K<sub>1</sub>=15, log K<sub>2</sub>=6 for L-glutamic acid (Glu), and log K<sub>1</sub>=15, log K<sub>2</sub>=7 for L-aspartic acid (Asp). The potential-pH equilibrium diagram for Pd<sup>2+</sup>-Glu (or Asp) and HCOO<sup>-</sup>-HCO<sub>3</sub><sup>-</sup> systems indicates that electroless palladium plating is thermodynamically possible when formic acid is used as the reducing agent. These complex baths exhibited good storage stability, and pure palladium films were deposited autocatalytically. Results of testing for solderability and for electrical contact resistance indicated that electroless pure palladium plating is suitable as an alternative to electrolytic and electroless gold plating of electronic parts.
- 表面技術 = The Journal of the Surface Finishing Society of Japan
表面技術 = The Journal of the Surface Finishing Society of Japan 49(12), 1322-1326, 1998-12-01
The Surface Finishing Society of Japan