ギ酸を還元剤とするモノアミノジカルボン酸錯体浴からの無電解パラジウムめっき Electroless Palladium Plating from Monoaminodicarboxylic Acid Complex Bath Using Formic Acid as a Reducing Agent

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An electroless Palladium plating aiming "no emission" were investigated using formic acid as the reducing agent, and monoaminodicarboxylic acid as the complexing agent. Stability constants of Pd<sup>2+</sup> complexes are log K<sub>1</sub>=15, log K<sub>2</sub>=6 for L-glutamic acid (Glu), and log K<sub>1</sub>=15, log K<sub>2</sub>=7 for L-aspartic acid (Asp). The potential-pH equilibrium diagram for Pd<sup>2+</sup>-Glu (or Asp) and HCOO<sup>-</sup>-HCO<sub>3</sub><sup>-</sup> systems indicates that electroless palladium plating is thermodynamically possible when formic acid is used as the reducing agent. These complex baths exhibited good storage stability, and pure palladium films were deposited autocatalytically. Results of testing for solderability and for electrical contact resistance indicated that electroless pure palladium plating is suitable as an alternative to electrolytic and electroless gold plating of electronic parts.

収録刊行物

  • 表面技術 = The Journal of the Surface Finishing Society of Japan  

    表面技術 = The Journal of the Surface Finishing Society of Japan 49(12), 1322-1326, 1998-12-01 

    The Surface Finishing Society of Japan

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各種コード

  • NII論文ID(NAID)
    10002111314
  • NII書誌ID(NCID)
    AN1005202X
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    09151869
  • NDL 記事登録ID
    4624041
  • NDL 雑誌分類
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL 請求記号
    Z17-291
  • データ提供元
    CJP書誌  NDL  J-STAGE 
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