次亜リン酸塩を還元剤とする無電解銅めっきによる導体層-絶縁樹脂層の密着性 Adhesion Improvement between Conductor and Insulation Layer with Electroless Copper Plating Using Hypophosphite as a Reducing Agent
In electroless copper plating using hypophosphite as a reducing agent, nickel ions are generally added to the electroless copper plating bath to initiate the auto catalytic reaction, because catalytic activity for anodic oxidation of hypophosphite on copper is low. If nickel ions are excluded from the plating bath, the plating reaction is be initiated only at palladium-catalyzed sites on resin and reaction finally terminates on deposited copper.<br>Adhesion strength between roughened epoxy resin and deposited copper by electroless copper plating using hypophosphite was studied. The plating reaction on palladium-catalyzed epoxy resin initiated and terminated when copper is deposited about 0.3μm. Accordingly, the amount and activity of adsorbed Pd on resin are influenced by the following plating reaction. Adsorbed Pd was increased by immersion in 0.3g/dm<sup>3</sup>-PdCl<sub>2</sub> solution followed by immersion in 0.25mol/dm<sup>3</sup>-NaH<sub>2</sub>PO<sub>2</sub> solution after conventional mixed catalyst processing. Adhesion strength between epoxy resin and deposited copper is about 1.53kgf/cm. Adhesion strength is higher than that in the plating using formaldehyde since deposited copper reaches small complicated etched pits.
- 表面技術 = The Journal of the Surface Finishing Society of Japan
表面技術 = The Journal of the Surface Finishing Society of Japan 49(12), 1327-1331, 1998-12-01
The Surface Finishing Society of Japan