電気銅めっきを用いた各種波形制御によるビアフィリング Vra Filling by Electroplating under Various Waveforms
Printed wiring board density is increasing with progress in electronic devices. Build-up has attracted in high-density mounting. Via-hole plating is used for standard layer-to-layer connection. The process becomes complicated because the insulation layer must be planarized by filling via holes with insulation resin or conductive paste after plating.<br>We studied the possibility of via filling by controlling the current waveform of current and additive agents for copper electroplating. Via-filling is achieved by applying low current during plating. Current waveform control and additive agent selection were affected to via filling.
- 表面技術 = The Journal of the Surface Finishing Society of Japan
表面技術 = The Journal of the Surface Finishing Society of Japan 49(12), 1332-1335, 1998-12-01
The Surface Finishing Society of Japan