電気銅めっきを用いた各種波形制御によるビアフィリング [in Japanese] Vra Filling by Electroplating under Various Waveforms [in Japanese]
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Printed wiring board density is increasing with progress in electronic devices. Build-up has attracted in high-density mounting. Via-hole plating is used for standard layer-to-layer connection. The process becomes complicated because the insulation layer must be planarized by filling via holes with insulation resin or conductive paste after plating.<br>We studied the possibility of via filling by controlling the current waveform of current and additive agents for copper electroplating. Via-filling is achieved by applying low current during plating. Current waveform control and additive agent selection were affected to via filling.
- Jitsumu Hyomen Gijutsu
Jitsumu Hyomen Gijutsu 49(12), 1332-1335, 1998-12-01
The Surface Finishing Society of Japan