無電解NiBめっきを用いたマイクロパターニングにおける錯化剤の影響 [in Japanese] Effect of Complexing Agents on Micro-pattern Formation Using Electroless NiB Plating [in Japanese]
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Electroless plating using dimethylamine-borane (DMAB) as a reducing agent showed poor selectivity of deposition on patterned surfaces formed using photoresist. In a basic study on selectivity, we studied the effect of complexing agent on micro-pattern formation using electroless NiB plating. Changing species and concentrations of complexing agents changed the formation of film deposition. We fabricated micro-pattern formation using electroless plating by selecting complexing agents. The combination of glycine and ammonium sulfate was found to be optimal to obtaining deposition with a smooth surface without voids only onto the catalyzed surface. It is thought that selectivity relates to stability of metal complexes rather than deposition rate and/or mixed potential. We found that the high stability of complexing agent yielded high selectivity.
- Jitsumu Hyomen Gijutsu
Jitsumu Hyomen Gijutsu 49(12), 1336-1342, 1998-12-01
The Surface Finishing Society of Japan