界面活性剤によるPTFE粒子表面改質のCu-PTFE分散めっきに及ぼす効果 Effect of PTFE surface Modification by surfactant on Cu-PTFE Composite Plating

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抄録

To codeposit metal with particles that are hydrophobic, such as PTFE, a surfactant is required to disperse particles in the bath. Excess surfactant may, however, cause trouble during plating such as hindering metal electrodeposition or inhibiting particle codeposition. We studied the relationship between pretreatment of PTFE and the morphology of the deposit from a CuSO<sub>4</sub> bath containing PTFE particles. We clarified that the codeposition process is improved by modifying the PTFE surface using the surfactant, then rinsing off excess surfactant. Combining nonionic and cationic surfactants yields a good morphology and appearance.

収録刊行物

  • 表面技術 = The Journal of the Surface Finishing Society of Japan  

    表面技術 = The Journal of the Surface Finishing Society of Japan 50(1), 78-83, 1999-01-01 

    The Surface Finishing Society of Japan

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各種コード

  • NII論文ID(NAID)
    10002111651
  • NII書誌ID(NCID)
    AN1005202X
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    09151869
  • NDL 記事登録ID
    2543951
  • NDL 雑誌分類
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL 請求記号
    Z17-291
  • データ提供元
    CJP書誌  NDL  J-STAGE 
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