書誌事項
- タイトル別名
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- Effect of PTFE Surface Modification by Surfactant on Cu-PTFE Composite Plating.
- カイメン カッセイザイ ニ ヨル PTFE リュウシ ヒョウメン カイシツ ノ Cu-PTFE ブンサン メッキ ニ オヨボス コウカ
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抄録
To codeposit metal with particles that are hydrophobic, such as PTFE, a surfactant is required to disperse particles in the bath. Excess surfactant may, however, cause trouble during plating such as hindering metal electrodeposition or inhibiting particle codeposition. We studied the relationship between pretreatment of PTFE and the morphology of the deposit from a CuSO4 bath containing PTFE particles. We clarified that the codeposition process is improved by modifying the PTFE surface using the surfactant, then rinsing off excess surfactant. Combining nonionic and cationic surfactants yields a good morphology and appearance.
収録刊行物
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- 表面技術
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表面技術 50 (1), 78-83, 1999
一般社団法人 表面技術協会
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詳細情報 詳細情報について
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- CRID
- 1390282679091371648
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- NII論文ID
- 10002111651
- 10009757318
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- NII書誌ID
- AN1005202X
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- COI
- 1:CAS:528:DyaK1MXnt1egtA%3D%3D
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- ISSN
- 18843409
- 09151869
- http://id.crossref.org/issn/09151869
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- NDL書誌ID
- 2543951
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可