粗化処理無しの平滑銅-エポキシ絶縁樹脂間の密着性 Adhesion between Flat Copper Surfaces and Epoxy Insulation Resin without Roughening
Adhesion strength between flat copper and epoxy resin was studied by forming sulfur codeposited copper films or sulfide films on the flat copper surface, with the following results:<br>1. Copper films from an electroless coper plating bath with sodium sulfide strongly adhered to epoxy resin. Adhesion strength was particularly improved by adding over 100ppm sodium sulfide tothe plating bath.<br>2. The formation of sulfide films on the copper surface using sodium sulfide solution also effectively improved adhesion. Triazine dithiole treatment also showed a similar effect.
- 表面技術 = The Journal of the Surface Finishing Society of Japan
表面技術 = The Journal of the Surface Finishing Society of Japan 50(1), 101-102, 1999-01-01
The Surface Finishing Society of Japan