粗化処理無しの平滑銅-エポキシ絶縁樹脂間の密着性 Adhesion between Flat Copper Surfaces and Epoxy Insulation Resin without Roughening
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Adhesion strength between flat copper and epoxy resin was studied by forming sulfur codeposited copper films or sulfide films on the flat copper surface, with the following results:<br>1. Copper films from an electroless coper plating bath with sodium sulfide strongly adhered to epoxy resin. Adhesion strength was particularly improved by adding over 100ppm sodium sulfide tothe plating bath.<br>2. The formation of sulfide films on the copper surface using sodium sulfide solution also effectively improved adhesion. Triazine dithiole treatment also showed a similar effect.
- Jitsumu Hyomen Gijutsu
Jitsumu Hyomen Gijutsu 50(1), 101-102, 1999-01-01
The Surface Finishing Society of Japan