スルファミン酸塩浴からのCu/Ni多層膜の作製 Preparation of Cu/Ni Multilater from Sulfamate Bath
Cu/Ni multilayers were deposited on a rotating disk electrode by galvanostatic pulse electrolysis in a bath containing 1mol/L nickel sulfamate, 0.005mol/L copper sulfamate, and 0.49mol/L boric acid at pH4.0 and 50°C. The Cu deposition current density was 0.8 times the limiting one to avoid dendritic growth. Ni was deposited at a current density of 15A/dm<sup>2</sup>. Cu/Ni multilayers were deposited with (111) preferred orientation on the stainless steel substrate with (110) preferred orientation.
- 表面技術 = The Journal of the Surface Finishing Society of Japan
表面技術 = The Journal of the Surface Finishing Society of Japan 50(2), 208-211, 1999-02-01
The Surface Finishing Society of Japan