流動層中でのニッケルのホウ化処理 Boriding of Nickel in Fluidized Bed

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Bonding is useful in surface hardening nickel (Ni) in many surface treatments. Although Ni boronized by powder-pack bonding with amorphous boron and by gas bonding with BCl<sub>3</sub> has been reported, few reports cover bonding in a fluidized bed. We analyzed the treated layer using X-ray diffraction (XRD), glancing incidence X-ray diffraction, glow discharge emission spectrometry (GDS), and electron probe microanalyzer (EPMA). High-temperature microhardness and friction and wear characteristics of boronized Ni were studied, with the following results:<br>(1) Bonding Ni at a high temperature over a long time in a fluidized bed showed flaking of the treated layer due to Ni siliconization.<br>(2) The Knoop hardness was 1300HK for the sample boronized 7.2ks at 1073K. The boride layer was about 25μm thick and consisted mainly of Ni<sub>2</sub>B and Ni<sub>3</sub>B.<br>(3) The high-temperature microhardness of boronized Ni is higher than that of untreated Ni below about 800K.<br>(4) Friction properties and wear resistance to SUJ2 and SUS304 were improved by Ni bonding.

収録刊行物

  • 表面技術 = The Journal of the Surface Finishing Society of Japan  

    表面技術 = The Journal of the Surface Finishing Society of Japan 50(3), 282-288, 1999-03-01 

    The Surface Finishing Society of Japan

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各種コード

  • NII論文ID(NAID)
    10002112046
  • NII書誌ID(NCID)
    AN1005202X
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    09151869
  • NDL 記事登録ID
    4677068
  • NDL 雑誌分類
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL 請求記号
    Z17-291
  • データ提供元
    CJP書誌  NDL  J-STAGE 
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