流動層中でのニッケルのホウ化処理 [in Japanese] Boriding of Nickel in Fluidized Bed [in Japanese]
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Bonding is useful in surface hardening nickel (Ni) in many surface treatments. Although Ni boronized by powder-pack bonding with amorphous boron and by gas bonding with BCl<sub>3</sub> has been reported, few reports cover bonding in a fluidized bed. We analyzed the treated layer using X-ray diffraction (XRD), glancing incidence X-ray diffraction, glow discharge emission spectrometry (GDS), and electron probe microanalyzer (EPMA). High-temperature microhardness and friction and wear characteristics of boronized Ni were studied, with the following results:<br>(1) Bonding Ni at a high temperature over a long time in a fluidized bed showed flaking of the treated layer due to Ni siliconization.<br>(2) The Knoop hardness was 1300HK for the sample boronized 7.2ks at 1073K. The boride layer was about 25μm thick and consisted mainly of Ni<sub>2</sub>B and Ni<sub>3</sub>B.<br>(3) The high-temperature microhardness of boronized Ni is higher than that of untreated Ni below about 800K.<br>(4) Friction properties and wear resistance to SUJ2 and SUS304 were improved by Ni bonding.
- Jitsumu Hyomen Gijutsu
Jitsumu Hyomen Gijutsu 50(3), 282-288, 1999-03-01
The Surface Finishing Society of Japan