Boriding of Nickel in Fluidized Bed.
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- UEDA Nobuhiro
- Technology Research Inst. of Osaka Pref.
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- SONE Takumi
- Technology Research Inst. of Osaka Pref.
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- MIZUKOSHI Tomoyuki
- Technology Research Inst. of Osaka Pref.
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- IKENAGA Akira
- College of Eng., Osaka Pref. Univ.
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- KAWAMOTO Makoto
- College of Eng., Osaka Pref. Univ.
Bibliographic Information
- Other Title
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- 流動層中でのニッケルのホウ化処理
- リュウドウソウ チュウ デ ノ ニッケル ノ ホウカ ショリ
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Abstract
Bonding is useful in surface hardening nickel (Ni) in many surface treatments. Although Ni boronized by powder-pack bonding with amorphous boron and by gas bonding with BCl3 has been reported, few reports cover bonding in a fluidized bed. We analyzed the treated layer using X-ray diffraction (XRD), glancing incidence X-ray diffraction, glow discharge emission spectrometry (GDS), and electron probe microanalyzer (EPMA). High-temperature microhardness and friction and wear characteristics of boronized Ni were studied, with the following results:<br>(1) Bonding Ni at a high temperature over a long time in a fluidized bed showed flaking of the treated layer due to Ni siliconization.<br>(2) The Knoop hardness was 1300HK for the sample boronized 7.2ks at 1073K. The boride layer was about 25μm thick and consisted mainly of Ni2B and Ni3B.<br>(3) The high-temperature microhardness of boronized Ni is higher than that of untreated Ni below about 800K.<br>(4) Friction properties and wear resistance to SUJ2 and SUS304 were improved by Ni bonding.
Journal
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- Journal of The Surface Finishing Society of Japan
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Journal of The Surface Finishing Society of Japan 50 (3), 282-288, 1999
The Surface Finishing Society of Japan
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Details 詳細情報について
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- CRID
- 1390001204114945024
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- NII Article ID
- 10002112046
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- NII Book ID
- AN1005202X
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- ISSN
- 18843409
- 09151869
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- NDL BIB ID
- 4677068
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed