超音波洗浄における異物除去メカニズム -共振気泡による摩擦作用- [in Japanese] Particle Removal Mechanism in Ultrasonic Cleaning -Scrubbing Action by Resonant Bubbles- [in Japanese]
Access this Article
Search this Article
This paper describes an experimental study of a particle removal mechanism in ultrasonic cleaning used in the electronic device manufacturing process. The results are stated briefly as follows;<br>(1) In ultrasonic cleaning, the scrubbing action of resonant bubbles removes particles.<br>(2) Neither the cleaning mechanism nor ability depend on ultrasonic frequency from 37kHz to 1MHz.<br>(3) Ultrasonic cleaning effectively removes perticles larger than 0.2μm in diameter.
- Jitsumu Hyomen Gijutsu
Jitsumu Hyomen Gijutsu 47(1), 37-41, 1996-01
The Surface Finishing Society of Japan