亜硫酸金錯体からの無電解金めっきのワイヤーボンディング性 Gold Wire Bondability of Electroless Gold Plating Using Disulfiteaurate Complex

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抄録

Gold wire bondability of non-cyanide electroless gold plating using disulfiteaurate complex was investigated. Generally, printed wiring boad is fabricated by subtractive or additive process. After fabricate the circuits, contact or terminal areas were usually coated with nickel and gold for maintaing reliability between printed circuit and another electrical functional parts. Usually, diluted palladium solution is adopted to initiate electroless nickel plating on a copper circuits. However, selectivity of nickel deposition on a resin based copper circuits is not good enough by treatment diluted palladium solution as an activator. Selectivity was greatly improved by treatment with strong reducing agents such as SBH, DMAB or TMAB. Bondability was greatly influenced by the contents of phosphorus in the deposited nickel. Gold crystal orientation was also affected by the gold wire bonding, and high bonding strength was obtained with (220), and (311) preferred oriented electroless gold films.

収録刊行物

  • 表面技術 = The Journal of the Surface Finishing Society of Japan

    表面技術 = The Journal of the Surface Finishing Society of Japan 47(3), 250-255, 1996-03

    The Surface Finishing Society of Japan

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各種コード

  • NII論文ID(NAID)
    10002255885
  • NII書誌ID(NCID)
    AN1005202X
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    09151869
  • NDL 記事登録ID
    3936739
  • NDL 雑誌分類
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL 請求記号
    Z17-291
  • データ提供元
    CJP書誌  CJP引用  NDL  J-STAGE 
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