無電解Ni-Pめっき膜のノジュールの発生要因 Origins of Nodules in Electroless Nickel-Phosphorus Deposition

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The origins of nodule formation in electroless nickel-phosphorus deposition were investigated. It was found that the pretreatment and plating conditions influenced the formation of nodules.<br>Nodules were observed in the fractographs of the depositions depending on changes in the surface morphology of the copper substrate when the plating baths included mono- or di- carboxylic acids. On the other hand, nodules were not observed in the fractographs of the depositions with plating baths that contained hydroxycarboxylic acids.<br>Nodules tended to be less likely to form when the deposition rate was relatively low and the phosphorus content of the deposition was high.

収録刊行物

  • 表面技術 = The Journal of the Surface Finishing Society of Japan  

    表面技術 = The Journal of the Surface Finishing Society of Japan 47(4), 349-355, 1996-04 

    The Surface Finishing Society of Japan

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各種コード

  • NII論文ID(NAID)
    10002256148
  • NII書誌ID(NCID)
    AN1005202X
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    09151869
  • NDL 記事登録ID
    3947926
  • NDL 雑誌分類
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL 請求記号
    Z17-291
  • データ提供元
    CJP書誌  NDL  J-STAGE 
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