分散めっきにおける電析Cu-ZrB_2複合層中のZrB_2含有量の制御 Control of ZrB_2 Content in the Cu-ZrB_2 Composite Layer Electrodeposited by Dispersion Plating

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抄録

We studied the ZrB<sub>2</sub> content in Cu-ZrB<sub>2</sub> composite layers produced by dispersion plating. The current density, stirrer rotation rate, and direction of substrate setup was changed to determine the conditions required to maximize ZrB<sub>2</sub> content in the matrix. The ZrB<sub>2</sub> particle codeposition rate reportedly depends on the plating current density and on the stirring rate of the plating solution. The optimum plating condition maximizing ZrB<sub>2</sub> content was at 5A·dm<sup>-2</sup> and 900rpm. Substrate setup in the direction of the plating solution stream is an important factors. A linear relationship exists between ZrB<sub>2</sub> content and the amount of Cu-ZrB<sub>2</sub> composite deposited in the region exceeding 10mg·cm<sup>-2</sup> of Cu-ZrB<sub>2</sub> composite.

収録刊行物

  • 表面技術 = The Journal of the Surface Finishing Society of Japan  

    表面技術 = The Journal of the Surface Finishing Society of Japan 47(6), 543-547, 1996-06 

    The Surface Finishing Society of Japan

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各種コード

  • NII論文ID(NAID)
    10002256606
  • NII書誌ID(NCID)
    AN1005202X
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    09151869
  • NDL 記事登録ID
    3976399
  • NDL 雑誌分類
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL 請求記号
    Z17-291
  • データ提供元
    CJP書誌  NDL  J-STAGE 
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