分散めっきにおける電析Cu-ZrB_2複合層中のZrB_2含有量の制御 [in Japanese] Control of ZrB_2 Content in the Cu-ZrB_2 Composite Layer Electrodeposited by Dispersion Plating [in Japanese]
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We studied the ZrB<sub>2</sub> content in Cu-ZrB<sub>2</sub> composite layers produced by dispersion plating. The current density, stirrer rotation rate, and direction of substrate setup was changed to determine the conditions required to maximize ZrB<sub>2</sub> content in the matrix. The ZrB<sub>2</sub> particle codeposition rate reportedly depends on the plating current density and on the stirring rate of the plating solution. The optimum plating condition maximizing ZrB<sub>2</sub> content was at 5A·dm<sup>-2</sup> and 900rpm. Substrate setup in the direction of the plating solution stream is an important factors. A linear relationship exists between ZrB<sub>2</sub> content and the amount of Cu-ZrB<sub>2</sub> composite deposited in the region exceeding 10mg·cm<sup>-2</sup> of Cu-ZrB<sub>2</sub> composite.
- Jitsumu Hyomen Gijutsu
Jitsumu Hyomen Gijutsu 47(6), 543-547, 1996-06
The Surface Finishing Society of Japan