Control of ZrB2 Content in the Cu-ZrB2 Composite Layer Electrodeposited by Dispersion Plating.

• ISE Buichi

  Tohoku Inst. of Tech.

• MEGURO Shinsaku

  Tohoku Inst. of Tech.

Bibliographic Information

Other Title

• 分散めっきにおける電析Ｃｕ‐ＺｒＢ２複合層中のＺｒＢ２含有量の制御
• ブンサン メッキ ニ オケル デンセキ Cu ZrB2 フクゴウソウチュウ ノ

Abstract

We studied the ZrB₂ content in Cu-ZrB₂ composite layers produced by dispersion plating. The current density, stirrer rotation rate, and direction of substrate setup was changed to determine the conditions required to maximize ZrB₂ content in the matrix. The ZrB₂ particle codeposition rate reportedly depends on the plating current density and on the stirring rate of the plating solution. The optimum plating condition maximizing ZrB₂ content was at 5A·dm^-2 and 900rpm. Substrate setup in the direction of the plating solution stream is an important factors. A linear relationship exists between ZrB₂ content and the amount of Cu-ZrB₂ composite deposited in the region exceeding 10mg·cm^-2 of Cu-ZrB₂ composite.

Journal

• Journal of The Surface Finishing Society of Japan

  Journal of The Surface Finishing Society of Japan 47 (6), 543-547, 1996

  The Surface Finishing Society of Japan

Keywords

• Dispersion Plating
• Zirconium Boride
• Cu Matrix
• Current Density
• Rotation Rate

Details

• CRID: 1390001204115824640
• NII Article ID: 10002256606
• NII Book ID: AN1005202X
• DOI: 10.4139/sfj.47.543
• ISSN: 18843409
• ISSN: 09151869
• NDL BIB ID: 3976399
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I3976399
• Text Lang: ja
• Data Source:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles
• Abstract License Flag: Disallowed