Cu/Co Multilayer Electrodeposition with Dual-Pulsed Current.

• MATSUNAGA Morio

  Kyushu Inst. of Tech.

• MISUMI Nobuhiro

  Kyushu Inst. of Tech.

• HOSOKAWA Kunisuke

  Kyushu Inst. of Tech.

Bibliographic Information

Other Title

• ダブルパルス法によるＣｕ／Ｃｏ多層膜の電析
• ダブル パルスホウ ニヨル Cu Co タソウ マク ノ デンセキ

Abstract

Cu/Co multilayer electrodeposition has been studied using a dual-pulsed current from pyrophosphate solutions. A pure copper layer is obtained with a current density lower than the diffusion-limited one of cupric ion. The cobalt content in the alloy layer increases with applied current density, and reaches about 95at.%. When the copper layer becomes thicker than 20nm and the alloy layer thicker than 15nm, the multilayer film becomes smooth. The well-defined modulation in the copper and cobalt composition was observed for Cu/Co multilayer deposits by Auger electron spectroscopy with Ar sputtering. The copper-content depth profile varies within the alloy layer, when the alloy layer is quite thin at a few nanometers. This compositional variation may be due to diffusion-layer disorder by hydrogen evolution or the cobalt hydroxide film formation on deposits.

Journal

• Journal of The Surface Finishing Society of Japan

  Journal of The Surface Finishing Society of Japan 47 (7), 623-627, 1996

  The Surface Finishing Society of Japan

Keywords

• Multilayer
• Cu-Co Alloy
• Electrodeposition
• Dual-Pulsed Current
• Thin Film

Details

• CRID: 1390282679092501632
• NII Article ID: 10002256811
• NII Book ID: AN1005202X
• DOI: 10.4139/sfj.47.623
• ISSN: 18843409
• ISSN: 09151869
• NDL BIB ID: 3995263
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I3995263
• Text Lang: ja
• Data Source:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles
• Abstract License Flag: Disallowed