パルス電位法による溶融塩中からのTa膜の電析とその耐食性 Electrodeposition of Ta Films from Molten Salt by Pulse Potential and Their Corrosion Resistance

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Tantalum films were electrodeposited on the nickel substrate by a pulse potential in NaCl-KCl molten salt containing K<sub>2</sub>TaF<sub>7</sub> at 1073K. The film morphology was investigated using SEM and film constituents using EPMA and X-ray diffraction analysis. Attention was focused particularly on the influence of the applied pulse potential on film morphology. Films consisted of an inner layer of metallic Ta and Ta-Ni intermetallic compounds and an outer layer of metallic Ta and tantalum oxide, and did not depend on the applied pulse potential. For film formed by polarization at pulse potentials of -11 and -0.6V, which generated a large cathodic and small anodic current, a thick, homogeneous inner layer was observed. Anodic polarization curves measured in a hot HNO<sub>3</sub> solution showed that samples with deposition films became passive in the solution. For the sample with film formed at pulse potentials of -1.1 and -06V, spontaneous passivation behavior, in particular, was observed, the same as for pure tantalum.

収録刊行物

  • 表面技術 = The Journal of the Surface Finishing Society of Japan  

    表面技術 = The Journal of the Surface Finishing Society of Japan 47(11), 963-968, 1996-11 

    The Surface Finishing Society of Japan

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各種コード

  • NII論文ID(NAID)
    10002257563
  • NII書誌ID(NCID)
    AN1005202X
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    09151869
  • NDL 記事登録ID
    4087653
  • NDL 雑誌分類
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL 請求記号
    Z17-291
  • データ提供元
    CJP書誌  NDL  J-STAGE 
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