次亜リン酸塩を還元剤とする無電解パラジウム -リン合金めっき皮膜の特性に及ぼすリン共析の影響 [in Japanese] Effect of Phosphorus Codeposition on Properties of Palladium-Phosphorus Alloys Deposited from Electroless Plating Baths Using Hypophosphite as a Reducing Agent [in Japanese]
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The effects of phosphorus codeposition on internal stress and occluded hydrogen in electroless plated palladium-phosphorus alloy films were investigated.<br>Phosphorus contents in alloy films were proportional to the 0.2 power of sodium hypophosphite concentration. Tensile stress and occluded hydrogen decreased with an increase in the phosphorus content in alloy films. The decrease of tensile stress in alloy films with phosphorus codeposition was found to inhibit the matching of the palladium crystal with phosphorus.
- Jitsumu Hyomen Gijutsu
Jitsumu Hyomen Gijutsu 47(12), 1060-1064, 1996-12-01
The Surface Finishing Society of Japan