Electroless Plating. Various Functional Applications of Formalin-Free Electroless Copper Plating.

• FUJINAMI Tomoyuki

  Central Res. Lab., Ebara Udylite Co., Ltd.

Bibliographic Information

Other Title

• 無電解めっき　ノーホルマリン無電解銅めっきの多機能化
• ノーホルマリン ムデンカイ ドウ メッキ ノ タキノウカ

Journal

• Journal of The Surface Finishing Society of Japan

  Journal of The Surface Finishing Society of Japan 48 (4), 387-392, 1997

  The Surface Finishing Society of Japan

Keywords

• Electroless Copper
• Hypophosphite
• Formalin-Free
• Basic Properties
• Various Functional Applications

Details

• CRID: 1390282679091184768
• NII Article ID: 10002258799
• NII Book ID: AN1005202X
• DOI: 10.4139/sfj.48.387
• ISSN: 18843409
• ISSN: 09151869
• NDL BIB ID: 4184928
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I4184928
• Text Lang: ja
• Data Source:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles