Preparation of Anisotropic Conductive Particles by Electroless Nickel Plating.
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- MOCHIZUKI Isamu
- Graduate School, Kanto Gakuin Univ.
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- IZAWA Kazuhiko
- Fac. of Eng., Kanto Gakuin Univ.
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- WATANABE Jyoji
- Graduate School, Kanto Gakuin Univ.
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- HONMA Hideo
- Fac. of Eng., Kanto Gakuin Univ.
Bibliographic Information
- Other Title
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- 無電解ニッケルめっきによる異方性導電微粒子の作製
- ムデンカイ ニッケル メッキ ニヨル イホウセイ ドウデン ビリュウシ ノ サ
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Abstract
Demand for mechanical solderless chip connection methods using anisotropic conductive particles has increased in the field of electronic devises. In this study, the preparation of conductive resin particles (5 to 10μm in diameter) by electroless nickel plating and the surface morphology of nickel film were investigated. Since the surface area of particles are much larger than in a bulk substrate, a batch-type electroless plating bath is unstable. Therefore, we applied the continuous dropping method to improve the stability of the Electroless nickel plating. The surface morphology of the deposited nickel was greatly influenced by the complexing agent used, the bath temperatrue and solution pH. Uniform deposits on the particles were obtained at pH 5 by using ammonium acetate as the complexing agent. In contrast, extraneous deposits were recognized at pH 5 when using sodium tartrate as the complexing agent and in baths at pH6. This extraneous deposition could be decreased by lowering the bath temperature.
Journal
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- Journal of The Surface Finishing Society of Japan
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Journal of The Surface Finishing Society of Japan 48 (4), 429-432, 1997
The Surface Finishing Society of Japan
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Details 詳細情報について
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- CRID
- 1390001204114475392
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- NII Article ID
- 10002258885
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- NII Book ID
- AN1005202X
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- COI
- 1:CAS:528:DyaK2sXisl2ht70%3D
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- ISSN
- 18843409
- 09151869
- http://id.crossref.org/issn/09151869
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- NDL BIB ID
- 4184935
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed