微小ビアホールへの無電解銅めっきの均一析出性 Uniformity of Electroless Copper Plating for Small Via Hole

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抄録

Electroless copper plating has been used in through hole and via hole plating on printed wiring boards. Build up has become an important production technique in preparing printed circuit boards as via holes have become more dense and miniaturized. Electroless Cu plating solution transportation and circulation in via holes become increasing difficult as holes have become smaller. Via hole deposition uniformity is decreased and electrical reliability between each layers deteriorates greatly. Accordingly, the uniformity of electroless copper plating was investigated using circuit boards contain via holes 20-200μm in diameter and 30-230μm deep. Uniform deposits are obtained by selecting parameters related to required deposition characteristics. Via filling using electroless Cu plating is also discussed.

収録刊行物

  • 表面技術 = The Journal of the Surface Finishing Society of Japan  

    表面技術 = The Journal of the Surface Finishing Society of Japan 48(4), 433-438, 1997-04-01 

    The Surface Finishing Society of Japan

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各種コード

  • NII論文ID(NAID)
    10002258894
  • NII書誌ID(NCID)
    AN1005202X
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    09151869
  • NDL 記事登録ID
    4184936
  • NDL 雑誌分類
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL 請求記号
    Z17-291
  • データ提供元
    CJP書誌  NDL  J-STAGE 
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