微小ビアホールへの無電解銅めっきの均一析出性 Uniformity of Electroless Copper Plating for Small Via Hole
Electroless copper plating has been used in through hole and via hole plating on printed wiring boards. Build up has become an important production technique in preparing printed circuit boards as via holes have become more dense and miniaturized. Electroless Cu plating solution transportation and circulation in via holes become increasing difficult as holes have become smaller. Via hole deposition uniformity is decreased and electrical reliability between each layers deteriorates greatly. Accordingly, the uniformity of electroless copper plating was investigated using circuit boards contain via holes 20-200μm in diameter and 30-230μm deep. Uniform deposits are obtained by selecting parameters related to required deposition characteristics. Via filling using electroless Cu plating is also discussed.
- 表面技術 = The Journal of the Surface Finishing Society of Japan
表面技術 = The Journal of the Surface Finishing Society of Japan 48(4), 433-438, 1997-04-01
The Surface Finishing Society of Japan