Cu/TiN薄膜間の付着力に対するTi膜の効果 Effect of Ti Film against the Adhesion between Cu and TiN Film

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The effect of Ti film inserted as an adhesion promoting layer in a Cu/Ti/TiN structure was studied. A Ti film 15nm thick clearly promoted adhesion, to a level four times that of a Cu/TiN structure, but the effect of a Ti film 80nm in thickness was not clear. The difference in effectiveness appears to be related to the structure of the Ti. The hydrogen included in the annealing atmosphere was occluded in the 80nm Ti, leading it to change to Ti hydride; TiH<sub>1.924</sub>. Ti hydride is known to be a brittle material. Even though it includes hydrogen, however, the 15nm Ti film does not change to Ti hydride and has a fcc structure, according to the results of high resolution TEM and electron diffraction. The 15nm thick Ti is thought to have an extremely strong effect as an adhesion layer, because Ti hydride is not generated in the Ti film.

収録刊行物

  • 表面技術 = The Journal of the Surface Finishing Society of Japan  

    表面技術 = The Journal of the Surface Finishing Society of Japan 48(4), 439-445, 1997-04-01 

    The Surface Finishing Society of Japan

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各種コード

  • NII論文ID(NAID)
    10002258900
  • NII書誌ID(NCID)
    AN1005202X
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    09151869
  • NDL 記事登録ID
    4184938
  • NDL 雑誌分類
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL 請求記号
    Z17-291
  • データ提供元
    CJP書誌  NDL  J-STAGE 
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