パルス電析法による常温型溶融塩浴からのNb-Sn合金の電析 Electrodeposition of Nb-Sn Alloy from Ambient-Temperature Molten Salt Electrolytes by Pulse Electrolysis
Electrodeposition of Nb-Sn alloy from ambient temperature molten salt electrolytes, i.e., an SnCl<sub>2</sub>-NbCl<sub>5</sub>-BPC (1-butylpyridinium chloride) system and an Sn-NbCl<sub>5</sub>-BPC system, by pulse electrolysis was investigated. The Nb content in the Nb-Sn electrodeposit was effected by the pulse period, current density, and duty ratio. Decreasing the duty ratio and increasing the current density increased the Nb content in the Nb-Sn alloy deposited from a 28.6mol%SnCl<sub>2</sub>-14.3mol%NbCl<sub>5</sub>-57.1mol%BPC bath. An Nb-Sn alloy containing 44.3wt% Nb was obtained from this bath at 60mA·cm<sup>-2</sup>, T=50ms, and a duty ratio of 0.2, An Nb-Sn alloy containing 41.3wt% Nb was deposited from a 7.7mol%Sn-15.4mol%NbCl<sub>5</sub>-76.9mol%BPC bath at 60mA·cm<sup>-2</sup>, T=10ms, and a duty ratio of 0.2.
- 表面技術 = The Journal of the Surface Finishing Society of Japan
表面技術 = The Journal of the Surface Finishing Society of Japan 48(4), 454-459, 1997-04-01
The Surface Finishing Society of Japan