高比抵抗無電解NiP薄膜の熱安定性 [in Japanese] Thermal Stability of High Resistivity NiP Thin Film Resistor Formed by Means of an Electroless Deposition [in Japanese]
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We investigated the 200°C annealing effect on high-resistivity electroless NiPC film containing 2.8at% carbon. In the step stress test for thermal stability, Film B of NiPC annealed at 200°C was 1, 280μΩcm, and showed almost no change in resistance even at low annealing temperature.
- Jitsumu Hyomen Gijutsu
Jitsumu Hyomen Gijutsu 48(4), 476-477, 1997-04-01
The Surface Finishing Society of Japan