高純度銅原料を用いた銅蒸着膜のめっき特性 Plating Characteristics of Vapor Deposited Copper Film Using High Purity Copper Sources

この論文にアクセスする

この論文をさがす

著者

抄録

Dendrite growth and the method of preventing the dendrite growth in nickel electroplating were studied on photochemically etched patterns of vapor depositing copper using a 99.99mass% (4N) copper source.<br>Soft chemical etching and increasing the plating power source ripple were found to be effective in preventing the dendrite growth. No dendrite growth with copper pattern formed using a 6N copper source or rolled or electrodeposited copper foil. It was found that copper patterns formed with a 6N copper source had higher resistivity in high temperature and high humidity testing than patterns formed with a 4N copper source.

収録刊行物

  • 表面技術 = The Journal of the Surface Finishing Society of Japan  

    表面技術 = The Journal of the Surface Finishing Society of Japan 48(5), 539-543, 1997-05-01 

    The Surface Finishing Society of Japan

参考文献:  9件

参考文献を見るにはログインが必要です。ユーザIDをお持ちでない方は新規登録してください。

各種コード

  • NII論文ID(NAID)
    10002259081
  • NII書誌ID(NCID)
    AN1005202X
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    09151869
  • NDL 記事登録ID
    4217061
  • NDL 雑誌分類
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL 請求記号
    Z17-291
  • データ提供元
    CJP書誌  NDL  J-STAGE 
ページトップへ