高純度銅原料を用いた銅蒸着膜のめっき特性 [in Japanese] Plating Characteristics of Vapor Deposited Copper Film Using High Purity Copper Sources [in Japanese]
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Dendrite growth and the method of preventing the dendrite growth in nickel electroplating were studied on photochemically etched patterns of vapor depositing copper using a 99.99mass% (4N) copper source.<br>Soft chemical etching and increasing the plating power source ripple were found to be effective in preventing the dendrite growth. No dendrite growth with copper pattern formed using a 6N copper source or rolled or electrodeposited copper foil. It was found that copper patterns formed with a 6N copper source had higher resistivity in high temperature and high humidity testing than patterns formed with a 4N copper source.
- Jitsumu Hyomen Gijutsu
Jitsumu Hyomen Gijutsu 48(5), 539-543, 1997-05-01
The Surface Finishing Society of Japan