Computer Simulation of Surface Finishing Technology. Adhesion Analysis for Si Substrate/Ti Thin Films Interface.

• KAMIYA Toyoharu

  Engineering Computing Dept., DENSO CO.

• SHIGEMATSU Koichi

  Engineering Computing Dept., DENSO CO.

• KONDO Ichiharu

  Production Engineering R&D, DENSO CO

• KINBARA Akira

  AMS R&D Center, Kanazawa Inst. of Technology

Bibliographic Information

Other Title

• 表面技術におけるコンピュータシミュレーション　有限要素法による表面密着性解析
• ユウゲン ヨウソホウ ニヨル ヒョウメン ミッチャクセイ カイセキ

Journal

• Journal of The Surface Finishing Society of Japan

  Journal of The Surface Finishing Society of Japan 48 (9), 895-899, 1997

  The Surface Finishing Society of Japan

Keywords

• Adhesion
• Computer Simulation
• Interface
• Stress
• Energy Release Rate

Details

• CRID: 1390001204114954368
• NII Article ID: 10002259776
• NII Book ID: AN1005202X
• DOI: 10.4139/sfj.48.895
• ISSN: 18843409
• ISSN: 09151869
• NDL BIB ID: 4304532
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I4304532
• Text Lang: ja
• Data Source:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles