ダイナミックイオンミキシング法による Ti_<1-x>Al_xN膜の電気化学インピーダンス特性 [in Japanese] Electrochemical Impedance Property of Ti_<-x>Al_xN Films Prepared by Dynamic Ion Mixing Method [in Japanese]
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The advanced coating material TiAlN has higher corrosion resistance than TiN without Al content. TiAlN films are conventionally prepared by sputtering using a target with fixed Ti and Al composition. We prepared Ti<sub>1-x</sub>Al<sub>x</sub>N films using a dynamic ion mixing apparatus with two electron-beam evaporation sources for Ti and Al deposition. Ti and Al contents of films were changed by independently controlling the evaporation rate of the two sources at a constant N concentration of 30%. This system controls the film Ti and Al composition ratio (value x) precisely.<br>Electrochemical film properties were measured using AC impedance and a fast Fourie transform analyzer. The measurement cell was constructed from two Ti<sub>1-x</sub>Al<sub>x</sub>N film samples coated on stainless steel used as electrodes in an HCl solution of 1mol/dm<sup>3</sup>. The equivalent circuit of the cell based on a typical parallel circuit, took film resistance <i>R<sub>f</sub></i> and capacity <i>C<sub>f</sub></i> into consideration and was determined by P-Spice simulation. Electrochemical properties were evaluated using interfacial resistance <i>R<sub>t</sub></i>, electrical double-layer capacity <i>C<sub>d</sub></i> and time constant <i>R<sub>t</sub></i>×<i>C<sub>d</sub></i> parameters. The Ti and Al composition ratio for optimum corrosion resistance was x=03.
- Jitsumu Hyomen Gijutsu
Jitsumu Hyomen Gijutsu 48(9), 913-918, 1997-09-01
The Surface Finishing Society of Japan